Advanced artificial intelligence systems utilise high-bandwidth memory chips, as those made by Samsung, SK Hynix, and Micron. They enable processors to process massive volumes of data rapidly, which is necessary for AI accelerators like Google’s Ironwood Tensor Processing Unit and Nvidia’s Rubin.
Read More: Gold, silver edge higher amid mixed signals on US-Iran dealAccording to the business, Samsung’s 12-layer HBM4E, which layers Dynamic Random-Access Memory vertically, has a 48-gigabyte capacity, which is more than 30% greater than the previous generation.
According to the South Korean chipmaker, depending on client needs, the range will be expanded to include an 8-layer 32GB and a 16-layer 64GB configuration.
In an effort to close the gap with SK Hynix and solidify its position in the market for next-generation AI memory, Samsung started distributing HBM4 chips to consumers in February.
First Published: May 29, 2026 7:49 AM IS

